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Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
Review of Packaging Schemes for Power Module
Characterization of PCB Embedded Package Materials for SiC MOSFETs
Extracting individual bricks from a laser scan point cloud of an unorganized pile of bricks
Range image technique for change analysis of rock slopes using dense point cloud data
Comparison of Nested-Loop Rotors in Brushless Doubly-Fed Induction Machines
Finite Element Analysis and Experimental Validation of Eddy Current Losses in Permanent Magnet Machines with Fractional-Slot Concentrated Windings
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