- Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
- Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
- Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study
- Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
- Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
- Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
- Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
- Naturally effective inhibition of microbial corrosion on carbon steel by beneficial biofilm in the South China Sea
- Revealing The Degradation Mechanism of (Sr,Ca)AlSiN3:Eu2+ Phosphor Aged Under Thermal-Moisture-Sulfur Conditions: A Combined Experimental and Ab Initio Study
- In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks
- Optimal Design of 100–2000 V 4H–SiC Power MOSFETs using Multi-objective Particle Swarm Optimization Algorithms
- Optimizing the chemical vapor deposition process of 4H–SiC epitaxial layer growth with machine-learning-assisted multiphysics simulations
- Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
- Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures
- Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
- Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient