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Alfaro Barrantes, J.A. (author), Mastrangeli, Massimo (author), Thoen, David (author), Visser, Sten (author), Bueno Lopez, J. (author), Baselmans, J.J.A. (author), Sarro, Pasqualina M (author)This paper describes the microfabrication and electrical characterization of aluminum-coated superconducting through-silicon vias (TSVs) with sharp superconducting transition above 1 K. The sharp superconducting transition was achieved by means of fully conformal and void-free DC-sputtering of the TSVs with Al, and is here demonstrated in up...journal article 2021
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Alfaro Barrantes, J.A. (author), Mastrangeli, Massimo (author), Thoen, David (author), Visser, Sven (author), Bueno Lopez, J. (author), Baselmans, J.J.A. (author), Sarro, Pasqualina M (author)This paper presents the fabrication and electrical characterization of superconducting high-aspect ratio through-silicon vias DC-sputtered with aluminum. Fully conformal and void-free coating of 300 μm-deep and 50 μmwide vias with Al, a CMOS-compatible and widely available superconductor, was made possible by tailoring a funneled sidewall...journal article 2020
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Alfaro Barrantes, J.A. (author), Mastrangeli, Massimo (author), Thoen, David (author), Bueno Lopez, J. (author), Baselmans, J.J.A. (author), Sarro, Pasqualina M (author)We describe a microfabrication process that, thanks to a specifically tailored sidewall profile, enables for the first-time wafer-scale arrays of high-aspect ratio through-silicon vias (TSVs) coated with DC-sputtered Aluminum, achieving at once superconducting and CMOS-compatible 3D interconnects. Void-free conformal coating of up to 500μm...conference paper 2020