Identification and Suppression of Multicomponent Noise in Audio Magnetotelluric Data Based on Convolutional Block Attention Module

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Warpage deformation analysis of AMB ceramic substrates in power modules

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Potential of BREEAM-C to support building circularity assessment: Insights from case study and expert interview

DACOOP-A: Decentralized Adaptive Cooperative Pursuit via Attention

Maximizing eco-environmental gains: Exploring underground wastewater treatment plants in Beijing for sustainable urban water management

Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Direct discharge of sewage to natural water through illicitly connected urban stormwater systems: An overlooked source of dissolved organic matter

Bio-inspired combinable self-powered soft device operating during the disintegration and reconstruction for next-generation artificial electric organs

Air infiltration and related building energy consumption: A case study of office buildings in Changsha, China

Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Spatial Resolution Matching of Microwave Radiometer Measurements Using Iterative Deconvolution with Close Loop Priors (ICLP)

Release behavior of soluble salts in MSWI bottom ash used as road basement materials under continuous rainfall conditions

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application