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Multi-parameters optimization for electromigration in WLCSP solder bumps
Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
Electromigration-induced local dewetting in Cu films
Effect of Thermomigration on Electromigration in SWEAT Structures
Implementation of Fully Coupled Electromigration Theory in COMSOL
Implementation of General Coupling Model of Electromigration in ANSYS
Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
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