Interpretation of the early stiffening process in alkali-activated slag pastes

To better understand early stiffening of AAS pastes, distinctive microstructural features by varying the silicate modulus (Ms) have been visualized with in-situ microscopy. In addition, the activation reaction was monitored with multiple approaches, while solid and liquid phases in hydrating AAS were characterized separately. In silicate...

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu₆Sn<sub>5</sub...