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Gebregiorgis, A.B. (author), Wu, L. (author), Münch, Christopher (author), Rao, Siddharth (author), Tahoori, Mehdi B. (author), Hamdioui, S. (author)STT-MRAM has long been a promising non-volatile memory solution for the embedded application space owing to its attractive characteristics such as non-volatility, low leakage, high endurance, and scalability. However, the operating requirements for high-performance computing (HPC) and low power (LP) applications involve different challenges....conference paper 2022
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Fan, J. (author), Wu, Jie (author), Jiang, Changzhen (author), Zhang, H. (author), Ibrahim, M.S. (author), Deng, Liang (author)To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...journal article 2020