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Wu, K. (author), Tichem, M. (author)
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a bottleneck in the development of commercially-available integrated photonic products. In the pursuit of a fully-automated, high-precision, and cost-effective photonic alignment scheme for two multi-channel photonic chips, this paper explores...
journal article 2018
document
Estevez, P. (author), Bank, J. (author), Porta, M. (author), Wei, J. (author), Sarro, P.M. (author), Tichem, M. (author), Staufer, U. (author)
This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...
journal article 2011