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Wu, K. (author), Tichem, M. (author)Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a bottleneck in the development of commercially-available integrated photonic products. In the pursuit of a fully-automated, high-precision, and cost-effective photonic alignment scheme for two multi-channel photonic chips, this paper explores...journal article 2018
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Estevez, P. (author), Bank, J. (author), Porta, M. (author), Wei, J. (author), Sarro, P.M. (author), Tichem, M. (author), Staufer, U. (author)This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...journal article 2011