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Ji, X. (author), van Ginkel, H.J. (author), Hu, D. (author), Schmidt-Ott, A. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...
conference paper 2022
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van Ginkel, H.J. (author), Orvietani, M. (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
In this work, a novel microfabrication-compatible production process is demonstrated and used to fabricate UV photoresistors made from ZnO nanoparticles. It comprises a simple room-temperature production method for synthesizing and direct-writing nanoparticles. The method can be used on a wide range of surfaces and print a wide range of...
conference paper 2022
document
van Ginkel, H.J. (author), Romijn, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are...
conference paper 2021