Warpage deformation analysis of AMB ceramic substrates in power modules

Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...

Modern Authentication Schemes in Smartphones and IoT Devices: An Empirical Survey

User authentication remains a challenging issue, despite the existence of a large number of proposed solutions, such as traditional text-based, graphical-based, biometrics-based, Web-based, and hardware-based schemes. For example, some of these schemes are not suitable for deployment in an Internet of Things (IoT) setting, partly due to the...