Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...

A study of fluid flow and heat transfer of three-dimensional plate-fin and tube heat exchangers by the least-squares finite element method

A numerical calculation procedure based on the least-squares finite element method (LSFEM) is employed to study the fluid flow and heat transfer in a 3-D heat exchangers with in-lined and staggered multiple-row (4 rows) tubes. In this study, the fin pitch of the heat exchanger is 8 fins per inch and the fluid flow is assumed steady,...