Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...

Experimental investigation on FRP-reinforced surface cracked steel plates subjected to cyclic tension

Surface cracked steel plates reinforced with single-side Fiber-Reinforced Polymer (FRP) subjected to cyclic tension are experimental studied. The main purpose is to analyze the effect of FRP reinforcement on the crack growth. The failure modes and their effects are analyzed as well. Given the single-side reinforcement, reinforcing the cracked...