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Multi-scale energy-based failure modeling of bond pad structures
Thermomechanical Multiscale Modelling of Substrates
Combined Virtual Prototyping and Reliability Testing Based Design Rules for Stacked Die System in Packages
Thin Film Interface Fracture Properties at Scales Relevant to Microelectronics
Computational Specification of Building Requirements in theEarly Stages of Design
Characterization and detection of building patterns in cartographic data: Two algorithms
Searched for: +
(321 - 326 of 326)
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17
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