Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Sustainable Assessment Tools for Higher Education Institutions: Developing Two-Hierarchy Tools for China

Higher Education Institutions (HEIs) play an increasingly significant role in the practice of sustainability. For HEIs in their early stages of sustainability, they are still in need of sustainable assessment tools (SATs) that are suitable for their local context and also lead international sustainable development. The purpose of this paper is...