Wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan-style Josephson junctions for superconducting quantum processors

We investigate die-level and wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan-style Josephson junctions, using multiple substrates with and without through-silicon vias (TSVs). Dolan junctions fabricated on planar substrates have the highest yield and lowest room-temperature conductance spread, equivalent to ∼ 100 M H z in...

All-Microwave Leakage Reduction Units for Quantum Error Correction with Superconducting Transmon Qubits

Minimizing leakage from computational states is a challenge when using many-level systems like superconducting quantum circuits as qubits. We realize and extend the quantum-hardware-efficient, all-microwave leakage reduction unit (LRU) for transmons in a circuit QED architecture proposed by Battistel et al. This LRU effectively reduces...

Post-fabrication frequency trimming of coplanar-waveguide resonators in circuit QED quantum processors

We present the use of a set of airbridges to trim the frequency of microwave coplanar-waveguide (CPW) resonators post-fabrication. This method is compatible with the fabrication steps of conventional CPW airbridges and crossovers and increases device yield by allowing compensation of design and fabrication uncertainty with 100 MHz range and...