Print Email Facebook Twitter Wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan-style Josephson junctions for superconducting quantum processors Title Wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan-style Josephson junctions for superconducting quantum processors Author Muthusubramanian, N. (TU Delft QN/Kavli Nanolab Delft) Finkel, M. (TU Delft QCD/DiCarlo Lab) Duivestein, W.J. (TU Delft QN/Groeblacher Lab) Zachariadis, C. (TU Delft QN/Kavli Nanolab Delft) van der Meer, S.L.M. (TU Delft QCD/DiCarlo Lab) Veen, H.M. (TU Delft QCD/DiCarlo Lab) Beekman, M.C. (TU Delft BUS/TNO STAFF; TNO) Stavenga, T. (TU Delft QCD/DiCarlo Lab) Bruno, A. (TU Delft QN/Kavli Nanolab Delft) DiCarlo, L. (TU Delft QCD/DiCarlo Lab; TU Delft QN/DiCarlo Lab) Date 2024 Abstract We investigate die-level and wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan-style Josephson junctions, using multiple substrates with and without through-silicon vias (TSVs). Dolan junctions fabricated on planar substrates have the highest yield and lowest room-temperature conductance spread, equivalent to ∼ 100 M H z in transmon frequency. In TSV-integrated substrates, Dolan junctions suffer most in both yield and disorder, making Manhattan junctions preferable. Manhattan junctions show pronounced conductance decrease from wafer center to edge, which we qualitatively capture using a geometric model of spatially-dependent resist shadowing during junction electrode evaporation. Analysis of actual junction overlap areas using scanning electron micrographs supports the model, and further points to a remnant spatial dependence possibly due to contact resistance. Subject transmonscalabilitythrough-silicon viasfrequency targetingDolan-bridge junctionManhattan-style junction To reference this document use: http://resolver.tudelft.nl/uuid:adc79ce6-2035-4804-91a0-087573bf3f8b DOI https://doi.org/10.1088/2058-9565/ad199c ISSN 2058-9565 Source Quantum Science and Technology, 9 (2) Part of collection Institutional Repository Document type journal article Rights © 2024 N. Muthusubramanian, M. Finkel, W.J. Duivestein, C. Zachariadis, S.L.M. van der Meer, H.M. Veen, M.C. Beekman, T. Stavenga, A. Bruno, L. DiCarlo Files PDF Muthusubramanian_2024_Qua ... 025006.pdf 1.71 MB Close viewer /islandora/object/uuid:adc79ce6-2035-4804-91a0-087573bf3f8b/datastream/OBJ/view