Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100...

Characterization of PCB Embedded Package Materials for SiC MOSFETs

In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...

Extracting individual bricks from a laser scan point cloud of an unorganized pile of bricks

Bricks are the vital component of most masonry structures. Their maintenance is critical to the protection of masonry buildings. Terrestrial Light Detection and Ranging (TLidar) systems provide massive point cloud data in an accurate and fast way. TLidar enables us to sample and store the state of a brick surface in a practical way. This...

Range image technique for change analysis of rock slopes using dense point cloud data

The use of a terrestrial laser scanner is examined to measure the changes of rock slopes subject to a wave attack test. Real scenarios are simulated in a water flume facility using a wave attack experiment representing a storm of 3000 waves. The stability of two rock slopes of different steepness was evaluated under the set conditions. For...