Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...

Discrete lattice fracture modelling of hydrated cement paste under uniaxial compression at micro-scale

A combination of laboratory experiments and numerical simulations at multiple length scales can provide in-depth understanding of fracture behaviour of hydrated cement paste (HCP). To that end, the current work presents a numerical study on compressive failure of hydrated cement paste (HCP) at the micro-scale. Virtual specimens consisting of...

Elucidating the effect of accelerated carbonation on porosity and mechanical properties of hydrated Portland cement paste using X-ray tomography and advanced micromechanical testing

Carbonation of hydrated cement paste (HCP) causes numerous chemo-mechanical changes in the microstructure, e.g., porosity, strength, elastic modulus, and permeability, which have a significant influence on the durability of concrete structures. Due to its complexity, much is still not understood about the process of carbonation of HCP. The...