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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)
The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...
conference paper 2023
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Wang, Zhe (author), Wu, Shilong (author), Chen, Hang (author), He, Mao-Kui (author), Du, Jun (author), Lee, Chin-Hui (author), Chen, Jingdong (author), Watanabe, Shinji (author), Siniscalchi, Sabato Marco (author), Scharenborg, O.E. (author), Liu, Diyuan (author)
The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...
conference paper 2023