Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

FPQNet: Fully Pipelined and Quantized CNN for Ultra-Low Latency Image Classification on FPGAs Using OpenCAPI

Convolutional neural networks (CNNs) are to be effective in many application domains, especially in the computer vision area. In order to achieve lower latency CNN processing, and reduce power consumption, developers are experimenting with using FPGAs to accelerate CNN processing in several applications. Current FPGA CNN accelerators usually use...

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...

Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...

Random forest incorporating ab-initio calculations for corrosion rate prediction with small sample Al alloys data

Corrosion jeopardizes the materials longevity and engineering safety, hence the corrosion rate needs to be forecasted so as to better guide materials selection. Although field exposure experiments are dependable, the prohibitive cost and their time-consuming nature make it difficult to obtain large dataset for machine learning. Here, we...

Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...

Patterning of fine-features in nanoporous films synthesized by spark ablation

Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...

Mechanical performance characterization of lignin-modified asphalt mixture

Lignin, as a bio-based waste, has been utilized in the asphalt industry due to various advantages. This study aimed to investigate the effects of two lignin products (lignin powder and lignin fiber) on the mechanical properties of asphalt mixtures. The raveling, rutting, thermal and fatigue cracking resistance, and moisture susceptibility of...

Efficiency and durability of g-C₃N₄-based coatings applied on mortar under peeling and washing trials

Durability of photocatalytic coatings is a major concern in engineering practice. Here, two types of novel visible light-responsive coatings, both consisting of vinyl chloride/vinyl ester/ethylene copolymer (as a binder) and graphitic carbon nitride (g-C₃N₄) but different in fabrication, are proposed and applied on the...

Optimizing Tailored Bus Bridging Paths

Metro disruptions due to unexpected events reduce transit system reliability, resulting in significant productivity loss and long passenger delays. Bus bridging strategy is often used to connect stations affected by metro disruptions such that passengers could continue their journey. The literature usually designed bridging routes and then...

Observations and numerical simulations of unsteady partial cavitation on 2-D hydrofoil