A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...

Reliability and Lifetime Prediction of Remote Phosphor Plates in Solid-State Lighting Applications Using Accelerated Degradation Testing

A methodology, based on accelerated degradation testing, is developed to predict the lifetime of remote phosphor plates used in solid-state lighting (SSL) applications. Both thermal stress and light intensity are used to accelerate degradation reaction in remote phosphor plates. A reliability model, based on the Eyring relationship, is also...