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Du, L. (author), Deng, Shanliang (author), Cui, Z. (author), Poelma, René H. (author), Beelen-Hendrikx, Caroline (author), Zhang, Kouchi (author)In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate...conference paper 2024
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Qian, Hongchang (author), Xu, Dake (author), Du, Cuiwei (author), Zhang, Dawei (author), Li, Xiaogang (author), Huang, Luyao (author), Deng, Leping (author), Tu, Yunchao (author), Mol, J.M.C. (author), Terryn, H.A. (author)This work introduces a new self-healing superhydrophobic coating based on dual actions by the corrosion inhibitor benzotriazole (BTA) and an epoxy-based shape memory polymer (SMP). Damage to the surface morphology (e.g., crushed areas and scratches) and the corresponding superhydrophobicity are shown to be rapidly healed through a simple heat...journal article 2017