Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...

Process-time Optimization of Vacuum Degassing Using a Genetic Alloy Design Approach

This paper demonstrates the use of a new model consisting of a genetic algorithm in combination with thermodynamic calculations and analytical process models to minimize the processing time during a vacuum degassing treatment of liquid steel. The model sets multiple simultaneous targets for final S, N, O, Si and Al levels and uses the total slag...