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ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin
A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound
Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation
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