Towards a digital twin architecture for the lighting industry

Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

Crossed Andreev Reflection and Elastic Cotunneling in Three Quantum Dots Coupled by Superconductors

Uncertainty analysis and interval prediction of LEDs lifetimes

Charge Sensing the Parity of an Andreev Molecule

LED Degradation Monitoring Using a Multi-Channel Spectral Sensor

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

AI-assisted Design for Reliability: Review and Perspectives

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Physics-Informed Machine Learning for Solder Joint Qualification Tests

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Adversarial Hamiltonian learning of quantum dots in a minimal Kitaev chain

Tunable Crossed Andreev Reflection and Elastic Cotunneling in Hybrid Nanowires

Spin-filtered measurements of Andreev bound states in semiconductor-superconductor nanowire devices

Degradation of silicone-based sealing materials used in microelectronics

Electrostatic control of the proximity effect in the bulk of semiconductor-superconductor hybrids

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application