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Zhang, Y. (author), Du, L. (author), Bäcke, Olof (author), Kalbfleisch, Sebastian (author), Zhang, Kouchi (author), Vollebregt, S. (author), Hörnqvist Colliander, Magnus (author)
As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to different electromigration conditions. The results suggest that the...
journal article 2024
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Du, L. (author), Deng, Shanliang (author), Cui, Z. (author), Poelma, René H. (author), Beelen-Hendrikx, Caroline (author), Zhang, Kouchi (author)
In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate...
conference paper 2024
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Mo, J. (author), Schaffar, Gerald J.K. (author), Du, L. (author), Maier-Kiener, Verena (author), Kiener, Daniel (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and...
conference paper 2024
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Zhu, Qi (author), Guo, Huadong (author), Zhang, Lu (author), Liang, Dong (author), Wu, Zherong (author), de Roda Husman, S. (author), Du, Xiaobing (author)
Surface melt plays a vital role in impacting the polar mass balance and global sea level rise. Over the past decades, synthetic aperture radar (SAR) imagery has garnered considerable attention due to its capacity to provide high-precision and long-term information. However, the traditional SAR-based large-scale surface melt detection methods...
journal article 2024
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Yue, X. (author), Mo, J. (author), Chen, Zhiyuan (author), Vollebregt, S. (author), Zhang, Kouchi (author), Du, S. (author)
Synchronized rectifiers offer promising solutions for piezoelectric energy harvesting; however, achieving the promised energy extraction performance necessitates using either a bulky inductor or multiple large capacitors, which cannot be on-chip integrated and increase the system form factor. This article introduces a fully integrated...
journal article 2024
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Feng, Xiangdong (author), Luo, Yuxuan (author), Cai, Tianyi (author), Xuan, Yangfan (author), Zhang, Yunshan (author), Shen, Yili (author), Yang, Changgui (author), Xiao, Qijing (author), Du, S. (author), Zhao, Bo (author)
The growing trend of the Internet of Things (IoT) involves trillions of sensors in various applications. An extensive array of parameters need to be gathered concurrently with high-precision, low-cost, and low-power sensor nodes, such as resistive (R) and capacitive (C) sensors. Single-chip channel fusion can be an effective solution, while...
journal article 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)
To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...
journal article 2024
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Zhen, Qi (author), Zhang, Anxiao (author), Bokel, R.M.J. (author), Zheng, Yue (author), Li, Jing (author), Du, Yiming (author), Zhang, Qi (author)
Most respiratory infectious disease transmission events occur in indoor environments, and examining the infection risk in different types of multi-zone buildings is critical to the safe reopening and use of public buildings. Appropriate space design influences occupant behavior and virus spread, thereby aiding in mitigating indoor infection...
journal article 2024
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Du, Guodong (author), Zou, Yuan (author), Zhang, Xudong (author), Li, Z. (author), Liu, Qi (author)
The autonomous vehicle is widely applied in various ground operations, in which motion planning and tracking control are becoming the key technologies to achieve autonomous driving. In order to further improve the performance of motion planning and tracking control, an efficient hierarchical framework containing motion planning and tracking...
journal article 2023
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Zhang, Lei (author), Liu, Wenjie (author), Du, Zhe (author), Du, Lei (author), Li, Xiaobin (author)
Collision avoidance is a priority task for ensuring the safety of a maritime transportation system. However, for a ship towing system, which is characterized by multiple vessels and physical connections, the research works about collision avoidance is limited. Thus, this paper proposes a speed and heading control-based conflict resolution of...
journal article 2023
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Long, Xu (author), Chong, Kainan (author), Su, Yutai (author), Du, L. (author), Zhang, Kouchi (author)
The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely characterized in order to adapt for numerical analysis and rational design of electronic packaging structures in this study. A framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal plastic...
journal article 2023
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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)
The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...
conference paper 2023
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Du, L. (author), Hu, D. (author), Poelm, René (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...
conference paper 2023
document
Du, L. (author), Zhao, Xiujuan (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...
conference paper 2023
document
Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...
journal article 2023
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Ji, X. (author), Du, L. (author), He, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...
journal article 2023
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Wang, Zaifa (author), Wang, Zhenyu (author), Xue, Dingchuan (author), Zhao, Jun (author), Zhang, Xuedong (author), Geng, Lin (author), Li, Yanshuai (author), Du, Congcong (author), Wagemaker, M. (author)
The rock-salt phase (RSP) formed on the surface of Ni-rich layered cathodes in liquid-electrolyte lithium-ion batteries is conceived to be electrochemically "dead". Here we show massive RSP forms in the interior of LiNi<sub>x</sub>Mn<sub>y</sub>Co<sub>(1−x-y)</sub>O<sub>2</sub> (NMC) crystals in sulfide based all solid state batteries (ASSBs)...
journal article 2023
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Du, B. (author), Lin, Bin (author), Xie, Wei (author), Zhang, Weidong (author), Negenborn, R.R. (author), Pang, Y. (author)
This paper addresses the flexible formation problem for unmanned surface vehicles in the presence of obstacles. Building upon the leader-follower formation scheme, a hybrid line-of-sight based flexible platooning method is proposed for follower vehicle to keep tracking the leader ship. A fusion artificial potential field collision avoidance...
conference paper 2022
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Gu, Guanjie (author), Yang, Changgui (author), Li, Zhuhao (author), Feng, Xiangdong (author), Chang, Ziyi (author), Wang, Ting-Hsun (author), Zhang, Yunshan (author), Luo, Yuxuan (author), Zhang, Hong (author), Wang, Ping (author), Du, S. (author), Chen, Yong (author), Zhao, Bo (author)
Body Channel Communication (BCC) offers a low-loss signal transmission medium for ultra-low-power wearable devices on human body [1]. However, the effective communication range on human body is limited to less than 1m in the state-of-the-art BCC transceivers [2], where the signal loss at the interface of body surface and BCC receiver remains to...
conference paper 2022
document
Du, L. (author), Zhao, Xiujuan (author), Watte, Piet (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...
conference paper 2022
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