Review of Manufacturing Process Defects and Their Effects on Memristive Devices

Complementary Metal Oxide Semiconductor (CMOS) technology has been scaled down over the last forty years making possible the design of high-performance applications, following the predictions made by Gordon Moore and Robert H. Dennard in the 1970s. However, there is a growing concern that device scaling, while maintaining cost-effective...

A DFT Scheme to Improve Coverage of Hard-to-Detect Faults in FinFET SRAMs

Manufacturing defects can cause faults in FinFET SRAMs. Of them, easy-to-detect (ETD) faults always cause incorrect behavior, and therefore are easily detected by applying sequences of write and read operations. However, hard-to-detect (HTD) faults may not cause incorrect behavior, only parametric deviations. Detection of these faults is of...

Challenges and Solutions in Emerging Memory Testing

The research and prototyping of new memory technologies are getting a lot of attention in order to enable new (computer) architectures and provide new opportunities for today’s and future applications. Delivering high quality and reliability products was and will remain a crucial step in the introduction of new technologies. Therefore,...