Recent Advances in Ferroelectret Fabrication, Performance Optimization, and Applications

The growing demand for wearable devices has sparked a significant interest in ferroelectret films. They possess flexibility and exceptional piezoelectric properties due to strong macroscopic dipoles formed by charges trapped at the interface of their internal cavities. This review of ferroelectrets focuses on the latest progress in...

Review of Packaging Schemes for Power Module

SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance...