Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide...

Multi-Axial Deformation Setup for Microscopic Testing of Sheet Metal to Fracture

While the industrial interest in sheet metal with improved specific-properties led to the design of new alloys with complex microstructures, predicting their safe forming limits and understanding their microstructural deformation mechanisms remain as significant challenges largely due to the inadequacy of the existing experimental tools. The...

A Micropillar Compression Methodology for Ductile Damage Quantification

Microstructural damage evolution is reported to influence significantly the failures of new high-strength alloys. Its accurate quantification is, therefore, critical for (1) microstructure optimization and (2) continuum damage models to predict failures of these materials. As existing methodologies do not fulfill the requirements, there is an...