Herrmann, A. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), De Buyl, F. (author), Fischer, H. R. (author), Mol, J.M.C. (author), Adan, O. C.G. (author) Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers, introducing a large amount of interface. While silane coupling...
journal article 2022
