Using solder paste in FDM based 3D printing of integrated electronics

 Starting this report 3Dprinting is explained and the state of the art in 3D printing structuralelectronics. From here the current state of the project is described afterwhich the project goal is formed. The project goal for this project is asfollows:  “Test and prototype on-sitecuring of solder paste on a 3D printed...