Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging

With the development of electronic technology towards high power, miniaturization, and system integration, power electronic packaging is facing increasing challenges, especially for die attachment. This research aims to explore silver-coated copper (Cu@Ag) paste with sufficient mechanical properties and high-temperature reliability, as an...

A facile method to prepare oriented boron nitride-based polymer composite with enhanced thermal conductivity and mechanical properties

Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for vertical heat dissipation. In addition, high BN content results in the...

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage caused by the pressure to the chip, improves reliability, and is widely applied in manufacturing....

Interface-Engineered Li₇La₃Zr₂O₁₂-Based Garnet Solid Electrolytes with Suppressed Li-Dendrite Formation and Enhanced Electrochemical Performance

High grain-boundary resistance, Li-dendrite formation, and electrode/Li interfacial resistance are three major issues facing garnet-based solid electrolytes. Herein, interfacial architecture engineering by incorporating 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl) imide (BMP-TFSI) ionic liquid into a garnet oxide is proposed....