Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Ultrasonic wedge bonding of aluminum (Al) wires is a widely applied interconnect technology for power electronic packaging. The joint quality of the wedge bonding is mainly affected by the process parameters and material properties. Inappropriate process parameters will lead to failure modes such as chip surface pit, metal layer peeling off,...

Shear capacity of a novel joint between corrugated steel web and concrete lower slab

Composite girder with corrugated steel web is one of the promising concrete-steel hybrid structures with superior properties and cost effectiveness widely applied in highway and railway bridges. The connection between concrete slabs and corrugated steel web is an important part of such composite structure. In order to improve pouring quality...