Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Ultrasonic wedge bonding of aluminum (Al) wires is a widely applied interconnect technology for power electronic packaging. The joint quality of the wedge bonding is mainly affected by the process parameters and material properties. Inappropriate process parameters will lead to failure modes such as chip surface pit, metal layer peeling off,...

Numerical parametric study on ultimate load and ductility of concrete encased equal-leg angle steel composite columns

Steel-concrete composite high bridge pier has been applied increasingly in China and around the world. Most applied steel type in the composite piers are H-shaped steel and steel pipe, while seldom research or practice is associated with angle steel. This paper conducted parametric study on the composite column with equal-leg angle steel and...