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Inamdar, A.S. (author), Gromala, Przemyslaw Jakub (author), Prisacaru, Alexandru (author), Kabakchiev, Alexander (author), Yang, Yu Hsiang (author), Han, Bongtae (author)Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic...book chapter 2022
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Zhang, M. (author), Han, N. (author), Xing, F. (author), Wang, X. (author), Schlangen, H.E.J.G. (author)For a microcapsule based self-healing system in the cementitious material, a fundamental issue is to find and facilitate a suitable microcapsule system, concerning either the material selection or design and manufacture process. In this study, urea formaldehyde resin is used for the shell of microcapsule, and bisphenol an epoxy resin E-51...conference paper 2013
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Zhang, M. (author), Han, N. (author), Xing, F. (author), Schlangen, H.E.J.G. (author)For a microcapsule based self-healing system in the cementitious material, a fundamental issue is to find and facilitate a suitable microcapsule system, concerning either the material selection or design and manufacture process. In this study, urea formaldehyde resin is used for the shell of microcapsule, and bisphenol – an epoxy resin E-51...conference paper 2013