Alfaro, J.A. (author), Sberna, P.M. (author), Silvestri, C. (author), Mastrangeli, Massimo (author), Ishihara, R. (author), Sarro, Pasqualina M (author) A novel, simple, low-cost method for the void-free filling of high aspect ratio (HAR) through-silicon-vias (TSVs) is presented. For the first-time pure indium, a type-I superconductor metal, is used to fill HAR vias, 300 to 500 μm in depth and 50 to 100 μm in diameter. The low electrical resistivity achieved without sintering, its...
conference paper 2018
