Warpage deformation analysis of AMB ceramic substrates in power modules

Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...

Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Combined effects of stress and temperature on hydrogen diffusion in non-hydride forming alloys applied in gas turbines

Hydrogen plays a vital role in the utilisation of renewable energy, but ingress and diffusion of hydrogen in a gas turbine can induce hydrogen embrittlement on its metallic components. This paper aims to investigate the hydrogen transport in a non-hydride forming alloy such as Alloy 690 used in gas turbines inspired by service conditions of...

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Ultrasonic wedge bonding of aluminum (Al) wires is a widely applied interconnect technology for power electronic packaging. The joint quality of the wedge bonding is mainly affected by the process parameters and material properties. Inappropriate process parameters will lead to failure modes such as chip surface pit, metal layer peeling off,...

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogenized equivalent model, with equivalent orthotropic material properties, gives excellent...

Fixation effects of different types of cannulated screws on vertical femoral neck fracture: A finite element analysis and experimental study

Femoral neck fractures (FNFs) in young patients usually result from high-energy violence, and the vertical transcervical type is typically challenging for its instability. FNFs are commonly treated with three cannulated screws (CS), but the role of screws type on fixation effects (FE) is unclear. The purpose of this study was to evaluate the...

Numerical parametric study on ultimate load and ductility of concrete encased equal-leg angle steel composite columns

Steel-concrete composite high bridge pier has been applied increasingly in China and around the world. Most applied steel type in the composite piers are H-shaped steel and steel pipe, while seldom research or practice is associated with angle steel. This paper conducted parametric study on the composite column with equal-leg angle steel and...

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...

An improved stress recovery technique for low-order 3D finite elements

In this paper, we propose a stress recovery procedure for low-order finite elements in 3D. For each finite element, the recovered stress field is obtained by satisfying equilibrium in an average sense and by projecting the directly calculated stress field onto a conveniently chosen space. Compared with existing recovery techniques, the...