Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...

Patterning of fine-features in nanoporous films synthesized by spark ablation

Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...

ZnO Nanoparticle Printing for UV Sensor Fabrication

In this work, a novel microfabrication-compatible production process is demonstrated and used to fabricate UV photoresistors made from ZnO nanoparticles. It comprises a simple room-temperature production method for synthesizing and direct-writing nanoparticles. The method can be used on a wide range of surfaces and print a wide range of...

High Step Coverage Interconnects By Printed Nanoparticles

The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are...

Dual-Gate Fet-Based Charge Sensor Enhanced by In-Situ Electrode Decoration in a MEMS Organs-On-Chip Platform

Continuous monitoring of tissue microphysiology is a key enabling feature of the organ-on-chip (OoC) approach for drug screening and disease modeling. Sensing charged species in OoC tissue microenvironments is thereby essential. However, the inherently small (i.e., cm) size of OoC devices poses the challenging requirement to integrate...