Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...

To Spike or Not To Spike: A Digital Hardware Perspective on Deep Learning Acceleration

As deep learning models scale, they become increasingly competitive from domains spanning from computer vision to natural language processing; however, this happens at the expense of efficiency since they require increasingly more memory and computing power. The power efficiency of the biological brain outperforms any large-scale deep...

Continuous Occupancy Mapping in Dynamic Environments Using Particles

Particle-based dynamic occupancy maps were proposed in recent years to model the obstacles in dynamic environments. Current particle-based maps describe the occupancy status in discrete grid form and suffer from the grid size problem, wherein a large grid size is unfavorable for motion planning while a small grid size lowers efficiency and...

A Cellular Automata Model of Oncolytic Virotherapy in Pancreatic Cancer

Oncolytic virotherapy is known as a new treatment to employ less virulent viruses to specifically target and damage cancer cells. This work presents a cellular automata model of oncolytic virotherapy with an application to pancreatic cancer. The fundamental biomedical processes (like cell proliferation, mutation, apoptosis) are modeled by the...

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Interfacial properties of Cu/SiO₂ in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO₂. The...