Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Prediction of the autogenous shrinkage and microcracking of alkali-activated slag and fly ash concrete

This study aims to predict the autogenous shrinkage of alkali-activated concrete (AAC) based on slag and fly ash. A variety of analytical and numerical models are available for the prediction of autogenous shrinkage of ordinary Portland cement (OPC) concrete, but these models are found to show dramatic discrepancies when applied for AAC due...

Durable lubricant-infused anodic aluminum oxide surfaces with high-aspect-ratio nanochannels

Recently, lubricant-infused surfaces (LIS) have emerged as a prominent class of surface technology for antifouling, anti-icing and anticorrosion applications. However, long-term corrosion exposure and mechanical damages may deteriorate the practical performance of LIS during application. In this study, a robust LIS was fabricated by the...