Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely...