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Li, Mingliang (author), Ren, S. (author), Liu, X. (author), Wu, Zhe (author), Zhang, Haopeng (author), Fan, Weiyu (author), Lin, P. (author), Xu, Jian (author)
This study aims to comprehensively investigate the rejuvenation efficiency of various self-developed compound rejuvenators on the physical, mechanical, and aging properties of aged bitumen, asphalt mortar, and mixture. The results revealed that the restoration capacity of vacuum distilled-oil rejuvenators on high-and-low temperature performance...
journal article 2022
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Fan, J. (author), Wu, Jie (author), Jiang, Changzhen (author), Zhang, H. (author), Ibrahim, M.S. (author), Deng, Liang (author)
To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...
journal article 2020