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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Wang, Wenbo (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...conference paper 2024
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Chen, Minggang (author), Zhang, H. (author), Fan, Q. (author)Silicon MOSFETs-based medium-power (< 50W) Class-D amplifiers (CDAs) switching in the MHz range have gained popularity in recent years, which achieves better linearity thanks to a higher loop gain in the audio band while enabling the use of LC filters with higher cut-off frequencies. However, for high-power (>100 W) CDAs, such switching...conference paper 2023
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Luopan, Yaxin (author), Han, Rui (author), Zhang, Qinglong (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)Deep Neural Networks (DNNs) have been ubiquitously adopted in internet of things and are becoming an integral of our daily life. When tackling the evolving learning tasks in real world, such as classifying different types of objects, DNNs face the challenge to continually retrain themselves according to the tasks on different edge devices....conference paper 2023
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Chen, Wei (author), Yan, Xuyang (author), Ibrahim, Mesfin S. (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...conference paper 2023
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Yu, Haoyuan (author), Zhang, Hanwen (author), Wang, Yanbo (author), Qin, Z. (author), Chen, Zhe (author), Bauer, P. (author)This article investigates the stability of triple active bridge (TAB) converter with different types of loads. In this paper, port2 of TAB converter adopts voltage control to supply a constant power load (CPL), and port3 uses voltage control to supply a resistor or uses current control to supply a battery. Then, an extra element theorem-based ...conference paper 2023
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Wen, Minzhen (author), Guo, Baotong (author), Chen, Shanghuan (author), Hu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have...conference paper 2023
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Zhang, Qinglong (author), Han, Rui (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)Vision applications powered by deep neural networks (DNNs) are widely deployed on edge devices and solve the learning tasks of incoming data streams whose class label and input feature continuously evolve, known as domain shift. Despite its prominent presence in real-world edge scenarios, existing benchmarks used by domain adaptation methods...conference paper 2023
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Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...conference paper 2022
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Chen, Haixue (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes...conference paper 2022
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Feng, Shuo (author), Jiang, Tao (author), Chen, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...conference paper 2022
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Gu, Guanjie (author), Yang, Changgui (author), Li, Zhuhao (author), Feng, Xiangdong (author), Chang, Ziyi (author), Wang, Ting-Hsun (author), Zhang, Yunshan (author), Luo, Yuxuan (author), Zhang, Hong (author), Wang, Ping (author), Du, S. (author), Chen, Yong (author), Zhao, Bo (author)Body Channel Communication (BCC) offers a low-loss signal transmission medium for ultra-low-power wearable devices on human body [1]. However, the effective communication range on human body is limited to less than 1m in the state-of-the-art BCC transceivers [2], where the signal loss at the interface of body surface and BCC receiver remains to...conference paper 2022
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Ying, Shen (author), Sun, Hanrui (author), Li, Chengpeng (author), Zhang, Wenting (author), Wang, Meng (author), Zhan, Yong (author), Zhang, Yu (author), Chen, Xueye (author)Many immigrants from rural areas pour into urban areas, especially in China, and urban development faces the challenges to provide sufficient space for citizens’ acommodation, works and social contacts. So 3D development and use of land and city space become the reality with various complex buildings and constructions with modern architecture...conference paper 2021
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Sun, Yubo (author), Chen, Boyu (author), Zhang, Shizhe (author), Blom, Kees (author), Luković, Mladena (author), Ye, Guang (author)In recent years, the rapid industrialization and urbanization led to the explosive growth of municipal solid waste incineration (MSWI) bottom ashes (BA) production. However, most of them are directly landfilled, which not only brings environmental burden but also results in loss of potential resources. Present researches have proved that MSWI BA...conference paper 2021
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Jin, Peng (author), Wang, Ruixing (author), Zhang, Siyi (author), Dong, Hua (author), Chen, Chun (author)Carbonation has been proven to be a promising way to improve the mechanism properties and durability of steel slag products. CA bacteria can promote the hydration of CO2. In this study, one kind of alkali-resistant CA bacteria was chosen to investigate its effects on the carbonation process of γ-C2S. Results showed that bacteria could increase...conference paper 2021
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Han, Weiwei (author), Chen, Huisu (author), Zhang, Tao (author)Magnesium ammonium phosphate cement (MAPC) has been commonly applied in civil engineering. However, the analysis of hydration behavior and composition of solid assemblages still needs further exploration. From thermodynamic simulation, it is shown that the molar ratio between MgO and NH4H2PO4 (M/P ratio) determines the final composition of...conference paper 2021
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Zhang, C. (author), Deng, Z.C. (author), Zhang, Y.M. (author), Chen, C. (author)This paper develops an empirical model to predict the static yield stress of 3D printing mortar based on the flowability of paste and excess paste thickness. The components of the mortar are divided into paste and aggregate. The relation between the yield stress of mortar and the yield stress of paste and the excess paste thickness is...conference paper 2021
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Sun, Yubo (author), Chen, B. (author), Zhang, Shizhe (author), Blom, Kees (author), Lukovic, M. (author), Ye, G. (author)In recent years, the rapid industrialization and urbanization led to the explosive growth of municipal solid waste incineration (MSWI) bottom ashes (BA) production. However, most of them are directly landfilled, which not only brings environmental burden but also results in loss of potential resources. Present researches have proved that MSWI BA...conference paper 2021
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Chen, B. (author), Sun, Yubo (author), Jacquemin, Loic (author), Zhang, Shizhe (author), Blom, Kees (author), Lukovic, M. (author), Ye, G. (author)At present, most municipal solid waste incineration (MSWI) bottom ash, as being disposed of as waste, is directly landfilled, raising concern about the environmental issue and potential loss of resources. Given that the natural raw materials used for cement production are being depleted, the recycling of MSWI bottom ash for the application as...conference paper 2019
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Chen, Yong (author), Lv, Maolong (author), Baldi, S. (author), Liu, Zongcheng (author), Zhang, Wenqian (author), Zhou, Yang (author)This work focuses on adaptive neural dynamic surface control (DSC) for an extended class of nonlinear MIMO strict-feedback systems whose control gain functions are continuous and possibly unbounded. The method is based on introducing a compact set which is eventually proved to be an invariant set: thanks to this set, the restrictive...conference paper 2019
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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...conference paper 2018
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