Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely...

Designing a 100 [aF/nm] capacitive transducer

The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...