High Step Coverage Interconnects By Printed Nanoparticles

The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are...

Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip

This paper focuses on the design and fabrication of a new programmable thermal test chip as a flexible and cost-effective solution for simplification of characterization/prototyping of new packages. The cell-based design format makes the chip fit into any modular array configuration. One unit cell is as small as 4x4 mm2, including 6 individually...