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Xiao, Tian (author), Zhang, Qiaoling (author), Yang, Xiaohu (author), Hooman, K. (author), Li, Guodong (author)
It is indicated that the solder joint of the metal fibrous materials is a critical factor impacting the heat conduction. To reveal the mechanism by which solder joint sizes, solder joint skips, solder flux materials, and filling media affect the thermal conductivity of fibres, pore-scale numerical simulation is employed to study the thermal...
journal article 2023
document
Li, Xueqiang (author), Zhang, Zhongyao (author), Wang, Qihui (author), Yang, Xiaohu (author), Hooman, K. (author), Liu, Shengchun (author)
Air cooling systems are widely used in current data centers owing to their low capital costs and high reliability. To satisfy the increasing rack power density, the optimal air-cooling technology and an economic analysis should be carefully discussed. Therefore, this study discusses four airflow management technologies: Case 1: raised floor...
journal article 2023
document
Guo, Junfei (author), Li, Ze (author), Wei, Pan (author), Li, Ling (author), Yang, Xiaohu (author), He, Ya Ling (author), Hooman, K. (author)
The integration of phase change materials (PCMs) and metal foam has been widely concerned recently. To decrease non-uniformity of uniform metal foam-PCMs, adaptive metal foam arrangement strategy with increasing porosity from inside to outside has attracted widespread attention. This work conducted a symmetric simulation model of vertical...
journal article 2023