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Yang, Jun (author), Paragi, Zsolt (author), Frey, Sándor (author), Gurvits, L. (author), Liao, Mai (author), Liu, Xiang (author), Cui, Lang (author), Yang, Xiaolong (author), Chen, Wen (author)
Dwarf galaxies are characterized by a very low luminosity and low mass. Because of significant accretion and ejection activity of massive black holes, some dwarf galaxies also host low-luminosity active galactic nuclei (AGNs). In a few dwarf AGNs, very long baseline interferometry (VLBI) observations have found faint non-thermal radio...
journal article 2023
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Chen, Yuanyuan (author), Dai, Hanqing (author), Hu, Zhe (author), Wei, Jinxin (author), Zhou, Wenjie (author), Duan, Zhongtao (author), Cui, Zhongjie (author), Wei, Wei (author), Zhang, Kouchi (author)
Hydrogel materials have biocompatibility, flexibility, transparency, self-healing ability, adhesion with various substrates, anti-freeze ability, and high-temperature resistance. However, the existing hydrogel devices cannot continue to operate in the case of damage, and they cannot work during the repair period, which brings great challenges...
journal article 2023
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...
journal article 2022
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Li, Huanhuan (author), Younes, S.H.H. (author), Chen, Shaohang (author), Duan, Peigao (author), Cui, Chengsen (author), Wever, Ron (author), Zhang, Wuyuan (author), Hollmann, F. (author)
In this contribution, we report chemoenzymatic bromodecarboxylation (Hunsdiecker-type) of α,ß-unsaturated carboxylic acids. The extraordinarily robust chloroperoxidase from Curvularia inaequalis (CiVCPO) generated hypobromite from H2O2 and bromide, which then spontaneously reacted with a broad range of unsaturated carboxylic acids and yielded...
journal article 2022
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Hu, R. (author), Ferrari, Riccardo M.G. (author), Chen, Z. (author), Cheng, Yuqiang (author), Zhu, Xiaobin (author), Cui, Xing (author), Wu, Jianjun (author)
This paper proposes a controller design for the electric pump of a deep-throttling rocket engine. The nonlinearity of the system is taken into consideration by analyzing the gap metric. Then, proportional-integral-derivative controller and gain-scheduling linear quadratic regulator are designed. Analyzing the amplitude- and phase-frequency...
journal article 2021
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Yao, Liaojun (author), Cui, Hao (author), Sun, Yi (author), Guo, Licheng (author), Chen, Xiangming (author), Zhao, Meiying (author), Alderliesten, R.C. (author)
The influence of fibre bridging on delamination failure in multidirectional composite laminates with different thickness scales is characterized, and the dependence of fibre bridging significance on laminate thickness as well as loading regime is investigated in this paper. Both quasi-static and fatigue resistance curves (R-curve) are...
journal article 2018
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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...
conference paper 2018
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Cui, Z. (author), Zhang, Yingying (author), Yang, Qun (author), Zhang, Kouchi (author), Chen, Xianping (author)
Interfacial properties of Cu/SiO<sub>2</sub> in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO<sub>2</sub>. The...
conference paper 2018
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