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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...
conference paper 2024
document
Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)
Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...
conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...
conference paper 2023
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Li, Shizhen (author), Liu, X. (author), Fan, Jiajie (author), Tan, C. (author), Wang, S. (author), Xie, Bin (author), Ye, H. (author)
The wide-bandgap semiconductors represented by GaN have a broad application prospect because of their high service temperature and high switch frequency. Quad-Flat-No-Lead (QFN) Package is currently one of the mainstream packaging methods due to its low cost and high efficiency. However, the low reliability of QFN used in GaN devices is still...
conference paper 2022
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Ma, Bingtao (author), Liu, Hongsen (author), Nan, L. (author), Tang, Xu (author), Fan, Huijie (author), Cong, Yang (author)
The 3D mesh is an important representation of geometric data. It is widely used in computer graphics and has attracted more attention in computer vision community recently. However, in the generation of mesh data, geometric deficiencies (e.g., duplicate elements, degenerate faces, isolated vertices, self-intersection, and inner faces) are...
conference paper 2021
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