Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...

High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes

In a high-power white light emitting diode (LED) package, the phosphor/silicone composite is typically used for photometric and colorimetric conversions, ultimately producing the white light. However, the phosphor/silicone composite is always exposed under harsh environments with high temperature, high blue light irradiation and high moisture...