Numerical analysis of the effect of the scan strategy on the residual stress in the multi-laser selective laser melting

The inevitably formed residual stress in the Selective Laser Melting (SLM) process leads to distortion, crack and even delamination of the workpiece. Single laser is commonly applied during SLM processing. However, its productivity is much lower than multiple lasers. In addition, the research of residual stress with multi-laser condition...

SlimML: Removing Non- critical Input Data in Large-scale Iterative Machine Learning

The core of many large-scale machine learning (ML) applications, such as neural networks (NN), support vector machine (SVM), and convolutional neural network (CNN), is the training algorithm that iteratively updates model parameters by processing massive datasets. From a plethora of studies aiming at accelerating ML, being data...

Germanene on single-layer ZnSe substrate: Novel electronic and optical properties

In this work, the structural, electronic and optical properties of germanene and ZnSe substrate nanocomposites have been investigated using first-principles calculations. We found that the large direct-gap ZnSe semiconductors and zero-gap germanene form a typical orbital hybridization heterostructure with a strong binding energy, which shows...

Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...

Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study

The sensing behavior of monolayer tin sulfide (SnS) for four gas molecules (NH₃, NO₂, CO, and H₂O) are studied by the first-principle calculation based on density-functional theory. We calculate adsorption energy, adsorption distance, and Hirshfeld charge to estimate the adsorption ability of monolayer SnS for...

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...